Mobile Phone BGA Hot Air Rework Station DH-5830
1 Piece Min. Order
Dimensions: 700*760*580mm
Gross Weight: 60KG
Rated Capacity: 4800W
Temperature Profile Storage: 50,000 groups
Voltage: AC220V±10％ 50Hz
Operation Mode: Manual+Touchscreen
Beskrivelse
Dinghua DH-5830 BGA Rework Station
This machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone,
Xbox, etc. With features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile,
Cooling Fan, Micro hot-air adjustment, Vacuum Pick-up & Place, Universal Support for most of
the PCB Size/Shape.
Product Application
Motherboard of computer,smartphone,laptop,digital camera ,air conditioner,TV and other electronic equipments
from medical industry,communication industry,automobile industry,etc.
Wide range of application: BGA, PGA, POP,BQFP, QFN, SOT- 223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chip.
SPECIFICATIONS | |
Total Power | 5500W |
Top heater Power | 1200W (1st Hot air heater) |
Bottom Heater | 1200W(2nd hot air heater), 3000W (IR preheat) |
Temperature Accuracy | ±2℃ |
Power Supply | AC220V±10％ 50Hz |
Dimension | 700x760x580mm (L*W*H) |
Temperature Profile Storage | 50,000 groups |
Operation Mode | Manual+Touchscreen |
PCB Support | V-groove + universal fixture + 5-points support + Adjustable in X direction |
Temperature Control | K-type Thermocouple + Closed Loop |
PCB Size | Max.410x370mm, Min. 22x22mm |
BGA Chip | 2x2mm-80x80mm |
Minimum Chip Spacing | 0.15mm |
External connector for temperature testing | 1pcs or Customized |
Net Weight | 35KG |
