Hot Air Soldering Reballing Machine

Hot Air Soldering Reballing Machine

Dinghua DH-A2E Hot Air Soldering Reballing Machine with infrared ceramic panel. The preheating areas are covered by tempered glass which ensures of no deformation of motherboard. This machine is suitable forlogic board iphone x,all other bottom board,motherboard iphone 7 plus,icloud removal,iphone 6 motherboard,for ps4 repair parts,ps3 ps4 console 500gb,playstation 3 motherboard,samsung tv motherboard,ps3 slim motherboard,playstation 4 etc.

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Automatic Hot Air Soldering Reballing Machine


BGA Reballing MachineProduct imga2


1.Product Features of Automatic Infrared Rework Station Repair BGA SMD  Machine

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•High successful rate of chip-level repairing. Desoldering, mounting and soldering process is automatic.

• Convenient alignment.

•Three independent temperature heatings + PID self-setting adjusted, temperature  accuracy will be on ±1°C

•Built-in vacuum pump, pick up and place BGA chips.

•Automatic cooling functions.


2.Specification of Automated Infrared Rework Station Repair BGA SMD Machine

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3.Details of Hot Air Automatic Infrared Rework Station Repair BGA SMD Machine

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4.Why Choose Our Automatic Infrared Rework Station Repair BGA SMD Machine?

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How does the automatic BGA rework station work: 


5.Certificate of Optical alignment automatic Infrared Rework Station 

Repair BGA SMD machine

BGA Reballing Machine


6. Packing list of Optics align CCD Camera Infrared Rework Station 

Repair BGA SMD machine

BGA Reballing Machine


7. Shipment of Automatic Infrared Rework Station Repair BGA SMD 

machine Split Vision

We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe.  If you prefer other terms 

of shipment, please feel free to tell us.


8.Contact us for instant reply and best price.

Email: john@dinghua-bga.com

MOB/WhatsApp/Wechat:  +8615768114827

Click the link to add my WhatsApp:

https://api.whatsapp.com/send?phone=8615768114827


9.Related knowledge of Automatic Infrared Rework Station Repair BGA SMD 

Ruilong 3000 sample comprehensive test: increase 15% frequency has reached 4.5GHz

After the accumulation of the previous two generations, the third-generation Ruilong 3000 series based on the new 

7nm technology and the new Zen 2 architecture is particularly worthy of expectation. The basic lock-up will be offici-

ally released at the Taipei Computer Show at the end of May.

According to the latest news from motherboard manufacturers, the samples of the Ruilong 3000 series have arrived 

at the motherboard partners in the first quarter of the year for related testing.

The test samples are all four cores, which obviously does not represent the specifications of the final retail version. Th-

is generation should have 12 cores or even 16 cores, but it is still uncertain whether the starter will be.

According to the motherboard manufacturer, preliminary tests show that the theoretical performance of the IPC core of

 the third-generation Ruilong has increased by about 15% compared with the second generation. In line with expectations,

 the improvement of the new architecture of Zen 2 is still obvious. It is necessary to know the Zen+ ratio of the second-ge-

neration Ruilong. The generation has only improved by about 3%.

The acceleration frequency of the three generations of Ruilong samples generally reached 4.5GHz, which is 200MHz high-

er than the highest level of the second generation. It is 500MHz higher than the current four cores, but the final retail vers-

ion will definitely have a higher frequency. Very conservative.

At the same time of frequency and performance improvement, thanks to the new technology and new architecture, the po-

wer consumption and heat generation of the three generations of Ruilong have been better controlled, and the energy effici-

ency has been greatly improved.

The memory controller has also improved, but it is less obvious. Considering that the DDR4 frequency currently supported 

by Ruilong is already quite high, the next step should be focused on improvements in stability, compatibility, and latency.


On the motherboard side, the X570 will become the new high-end main force, with PCIe 4.0 on the desktop and up to 40 cha-

nnels, 16 of which are dedicated to PCIe graphics slots, which can be split into x8+x4+x4, but some The channel will be share-

d with the SATA interface.

The SATA interface supports up to 12, and the USB interface has up to 8 USB 3.1 Gen. 2 and 4 USB 2.0.

There should be a new B550 in the mainstream market in the future, but PCIe 4.0 is no longer supported. The X570 is curre-

ntly the only platform with this technology.

The B350 and X370 motherboards have confirmed that they will continue to be compatible with the third-generation Ruilo-

ng, but the entry-level A320 is basically no longer.




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